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Micro-strand heat dissipation system

專利號(hào)
US11160196B1
公開日期
2021-10-26
申請(qǐng)人
Dell Products L.P.(US TX Round Rock)
發(fā)明人
Victor Teeter; Shree Rathinasamy
IPC分類
H05K7/20; G06F1/20
技術(shù)領(lǐng)域
dissipator,strand,micro,heat,processing,elements,in,element,device,connector
地域: TX TX Round Rock

摘要

A micro-strand heat dissipation system includes a first processing device and a plurality of first micro-strand heat dissipator elements that are each positioned on the first processing device in a spaced apart orientation from the other first micro-strand heat dissipator elements. Each of the plurality of first micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that extends into the first processing device from an outer surface of the first processing device, and a second micro-strand heat dissipator element portion that extends from the outer surface of the first processing device. The first processing device may define a plurality of micro-strand heat dissipator connector features to which each of the plurality of first micro-strand heat dissipator elements may be connected, or the plurality of first micro-strand heat dissipator elements may be integrated as part of the first processing device.

說(shuō)明書

Similarly as well, a micro-strand heat dissipator element 1410 is illustrated that includes a first micro-strand heat dissipator element portion that extends from the outer surface of the base 1402, and that includes a pair of micro-strand heat dissipator element portions 1410a and 1410b that extend into the base 1402 from its outer surface and that are oriented substantially parallel to the first micro-strand heat dissipator element portion of the micro-strand heat dissipator element 1408 that extends from the outer surface of the base 1402 but in different planes than the first micro-strand heat dissipator element portion of the micro-strand heat dissipator element 1408 that extends from the outer surface of the base 1402. As will be appreciated by one of skill in the art in possession of the present disclosure, the micro-strand heat dissipator element portion 1406a, 1408a, 1410a, and 1410b may be routed to locations in the base 1402 where heat generation is expected or known to occur, which allows the first micro-strand heat dissipator element portions of their respective micro-strand heat dissipator elements 1406, 1408, and 1410 that extend from the outer surface of the base 1402 to dissipate that heat more efficiently.

權(quán)利要求

1
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