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Component mounting system and component data creation method

專利號(hào)
US11160201B2
公開日期
2021-10-26
申請(qǐng)人
Panasonic Intellectual Property Management Co., Ltd.(JP Osaka)
發(fā)明人
Hideo Matsuoka
IPC分類
H05K13/08
技術(shù)領(lǐng)域
component,mounting,data,master,reel,unit,arranging,apparatus,tape,barcode
地域: Osaka

摘要

A component mounting system includes a component mounting apparatus, a data creating apparatus and a component arranging operation supporting apparatus. The component mounting apparatus mounts components on a substrate. The data creating apparatus creates component data for each component. The component arranging operation supporting apparatus includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks a component to be disposed in a position based on the component identification information. The control unit of the component arranging operation supporting apparatus performs a request for a creation of component data regarding an alternative component, and the data creating apparatus receives the request and creates the component data regarding the alternative component.

說明書

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority of Japanese Patent Application No. 2014-128750 filed on Jun. 24, 2014, the contents of which are incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a component mounting system that mounts a component on a substrate, and a component data creation method.

2. Description of the Related Art

In the field of mounting electronic components, a method in which a plurality of mounting lines provided with a plurality of component mounting apparatuses that mounts components on substrates is arranged and in which the substrates are produced in each mounting line has been adopted. The component mounting apparatus that picks up components supplied from a plurality of tape feeders arranged in a component supplying unit by using a mounting head and mounts the picked-up components on the substrate has been known. The mounting head is controlled based on component data as a control parameter which is created for each component.

At a production site, multiple types of components which have the same electrical characteristics and are manufactured by different component manufacturers are used in some cases due to reasons such as convenience of the component supply. As the type of the component which is used, there are a master component that is preferentially used as a mounting target and an alternative component that is used when the master component is not in stock. In the related art, a component supplying method using these components has been suggested (for example, see Japanese Patent No. 3509107).

權(quán)利要求

1
What is claimed is:1. A component mounting system comprising:a component mounting apparatus which mounts components supplied from a component supply member disposed in a component supplying unit on a substrate;a data creating apparatus which creates component data, which is a control parameter set for mounting the component on the substrate by the component mounting apparatus, for each component; anda component arranging operation supporting apparatus which includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks whether or not the component disposed in a predetermined position in the component supplying unit is a component to be disposed in the predetermined position based on the component identification information acquired by the identification information acquiring unit, whereinthe control unit of the component arranging operation supporting apparatus includes a component data creation requesting unit that transmits the component identification information acquired by the identification information acquiring unit and identification information related to an alternative component that is used as an alternative to the component to the data creating apparatus and performs a request for a creation of component data regarding the alternative component, andthe data creating apparatus receives the request from the component data creation requesting unit and creates the component data regarding the alternative component by copying the component data regarding the component that is replaced with the alternative component,wherein the component mounting apparatus is configured to mount the alternative component supplied from the component supply member to the substrate based on the component data regarding the alternative component created by the data creating apparatus.2. A method of a component mounting system that includes a component mounting apparatus which mounts components supplied from a component supply member disposed in a component supplying unit on a substrate, a data creating apparatus which creates component data, which is a control parameter set for mounting the component on the substrate by the component mounting apparatus, for each component, and a component arranging operation supporting apparatus which includes an identification information acquiring unit that acquires component identification information given to the component supplying member and a control unit that checks whether or not the component disposed in a predetermined position in the component supplying unit is a component to be disposed in the predetermined position based on the component identification information acquired by the identification information acquiring unit, the method comprising:causing the identification information acquiring unit to acquire identification information related to the component and identification information related to an alternative component that is used as an alternative to the component;causing the component arranging operation supporting apparatus to transmit both of the identification information related to the component and the alternative component acquired by the identification information acquiring unit to the data creating apparatus;causing the data creating apparatus to create component data regarding the alternative component based on both of the identification information related to the component and the alternative component received from the component arranging operation supporting apparatus; andcausing the component mounting apparatus to mount the alternative component supplied from the component supply member to the substrate based on the created component data regarding the alternative component,wherein the component data regarding the alternative component is created by copying the component data regarding the component which is replaced with the alternative component.
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