白丝美女被狂躁免费视频网站,500av导航大全精品,yw.193.cnc爆乳尤物未满,97se亚洲综合色区,аⅴ天堂中文在线网官网

Component mounting system and component data creation method

專利號
US11160201B2
公開日期
2021-10-26
申請人
Panasonic Intellectual Property Management Co., Ltd.(JP Osaka)
發(fā)明人
Hideo Matsuoka
IPC分類
H05K13/08
技術(shù)領(lǐng)域
component,mounting,data,master,reel,unit,arranging,apparatus,tape,barcode
地域: Osaka

摘要

A component mounting system includes a component mounting apparatus, a data creating apparatus and a component arranging operation supporting apparatus. The component mounting apparatus mounts components on a substrate. The data creating apparatus creates component data for each component. The component arranging operation supporting apparatus includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks a component to be disposed in a position based on the component identification information. The control unit of the component arranging operation supporting apparatus performs a request for a creation of component data regarding an alternative component, and the data creating apparatus receives the request and creates the component data regarding the alternative component.

說明書

The component data 20 is data including various information related to the component, and includes a “control parameter” 20b and a “component ID” 20a which are both pieces of identification information related to each component which are combined with each other. The “control parameter” 20b includes a component size, an acceleration that defines the operation of the suction nozzle 11a, and information related to a switching timing at which a valve connected to the suction nozzle 11a is turned on or off. The control unit 17 controls the operation of the mounting head 11 to pick up the component and to mount the picked-up component on the substrate 12 based on the component data 20. As mentioned above, the component data 20 is used as a control parameter when the component is mounted on the substrate 12 by the mounting machines M1 to M3.

The component group data 21 is data obtained by grouping a master component and an alternative component that can be mounted on a common mounting position, and includes a “master component ID” 21a and an “alternative component ID” 21b which are combined with each other. The master component refers to a primary component provided as a mounting target to be mounted in one mounting position. The alternative component refers to a component that has the same electrical characteristics as those of the master component and can be mounted as an alternative to the master component. In general, the master component is preferentially used at a production site, and the alternative component is used in an emergency situation when the master component is not in stock. In the present specification, a case where the component is simply referred to as the “component” refers to the “master component”.

權(quán)利要求

1
微信群二維碼
意見反饋