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Dynamic feature and performance testing and adjustment

專利號
US11175908B2
公開日期
2021-11-16
申請人
MX Technologies, Inc.(US UT Lehi)
發(fā)明人
Ryan McBride; Brandon Dewitt; Shane Smit; Josh Bodily
IPC分類
G06F8/70; G06F11/36; G06N20/00
技術(shù)領(lǐng)域
or,module,adjustment,device,testing,feature,mobile,in,may,user
地域: UT UT Lehi

摘要

Apparatuses, methods, systems, and computer program products are presented for dynamic feature and performance testing and adjustment. An audit module is configured to dynamically test a plurality of image capture settings for a camera of a mobile device of an end user in an executable mobile application executing on the mobile device. A feature module is configured to select one of a plurality of image capture settings for a camera of a mobile device based on a dynamic test. An adjustment module is configured to dynamically configure, during runtime of an executable mobile application on a plurality of different mobile devices of different end users, the different mobile devices to use a selected one of a plurality of image capture settings.

說明書

These features and advantages of the embodiments will become more fully apparent from the following description and appended claims, or may be learned by the practice of embodiments as set forth hereinafter. As will be appreciated by one skilled in the art, aspects of the present invention may be embodied as a system, method, and/or computer program product. Accordingly, aspects of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment (e.g., including firmware, resident software, micro-code, etc. stored on a non-transitory computer readable storage medium) or an embodiment combining software and hardware aspects that may all generally be referred to herein as a “circuit,” “module,” or “system.” Furthermore, aspects of the present invention may take the form of a computer program product embodied in one or more non-transitory computer readable storage medium(s) having program code embodied thereon.

Many of the functional units described in this specification have been labeled as modules, in order to more particularly emphasize their implementation independence. For example, a module may be implemented as a logic hardware circuit comprising custom VLSI circuits or gate arrays (e.g., an application specific integrated circuit), off-the-shelf semiconductors such as logic chips, transistors, and/or other discrete components. A module may also be implemented in one or more programmable hardware devices such as field programmable gate arrays, programmable array logic, programmable logic devices, or the like.

權(quán)利要求

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