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Method of filling recess

專利號
US11177133B2
公開日期
2021-11-16
申請人
TOKYO ELECTRON LIMITED(JP Tokyo)
發(fā)明人
Satoshi Takagi; Yoshimasa Watanabe
IPC分類
H01L21/02; H01L21/268
技術(shù)領(lǐng)域
gas,laser,film,501a,amorphous,recess,silicon,annealing,in,wafer
地域: Tokyo

摘要

A method of filling a recess according to one embodiment of the present disclosure comprises heating an amorphous semiconductor film without crystallizing the amorphous semiconductor film by radiating laser light to the amorphous semiconductor film embedded in the recess.

說明書

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In the above example, the case in which the amorphous silicon film is formed has been described, but the present disclosure is not limited thereto. The method of filling a recess may be applied to a case in which, for example, an amorphous germanium film or an amorphous silicon germanium film is formed. Each of the amorphous germanium film and the amorphous silicon germanium film may be, for example, a non-doped film or a doped film.

In the case of forming an amorphous germanium film, for example, a germanium source gas may be used instead of the silicon source gas. In addition, a halogen-containing germanium gas, for example, may be used instead of the halogen-containing silicon gas. Further, a hydrogenated germane gas, for example, may be used instead of the hydrogenated silane gas. Furthermore, an aminogermane-based gas, for example, may be used instead of the aminosilane-based gas.

The halogen-containing germanium gas may be, for example, a fluorine-containing germanium gas such as GeF4, GeHF3, GeH2F2, or GeH3F, a chlorine-containing germanium gas such as GeCl4, GeHCl3, GeH2Cl2, or GeH3Cl, or a bromine-containing germanium gas such as GeBr4, GeHBr3, GeH2Br2, or GeH3Br. The hydrogenated germane gas may be, for example, GeH4, Ge2H6, or Ge3H8. The aminogermane-based gas may be, for example, dimethylamino germane (DMAG), diethylamino germane (DEAG), bis(dimethylamino)germane (BDMAG), bis(diethylamino)germane (BDEAG), or tri(dimethylamino)germane (3DMAG).

權(quán)利要求

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