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Method for dicing integrated fan-out packages without seal rings

專利號
US11177142B2
公開日期
2021-11-16
申請人
Taiwan Semiconductor Manufacturing Company, Ltd.（TW Hsinchu）
發(fā)明人
Li-Hsien Huang; Yueh-Ting Lin; An-Jhih Su; Ming Shih Yeh; Der-Chyang Yeh
IPC分類
H01L21/56; H01L23/31; H01L25/16; H01L21/683; H01L23/00; H01L25/00
技術(shù)領(lǐng)域
die,dicing,conductive,molding,packages,in,pillars,dielectric,package,structure
地域： Hsinchu

摘要

A method includes attaching a first die and a second die to a carrier; forming a molding material between the first die and second die; and forming a redistribution structure over the first die, the second die and the molding material, the redistribution structure includes a first redistribution region; a second redistribution region; and a dicing region between the first redistribution region and the second redistribution region. The method further includes forming a first opening and a second opening in the dicing region, the first opening and the second opening extending through the redistribution structure and exposing the molding material; and separating the first die and the second die by cutting through a portion of the molding material aligned with the dicing region from a second side of the molding material toward the first side of the molding material, the second side opposing the first side.

說明書

As illustrated in FIG. 6, the redistribution structure 140′ further comprises a portion in a region 300 (may also be referred to as a dicing region) between the regions 100 and 200. A width of the dicing region 300 may be between about 40 μm and about 260 μm, such as about 40 μm, although other dimensions are also possible. In some embodiments, the portion of the redistribution structure 140′ in the region 300 comprises only the dielectric layers (see, e.g., 142, 144, 146, 148 in FIG. 4), and there is no electrically conductive features (e.g., conductive lines, visa) in the region 300. In addition, there is no seal ring formed in the redistribution structure 140′, in the illustrated embodiment.

權(quán)利要求

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