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Method for dicing integrated fan-out packages without seal rings

專利號(hào)
US11177142B2
公開日期
2021-11-16
申請(qǐng)人
Taiwan Semiconductor Manufacturing Company, Ltd.（TW Hsinchu）
發(fā)明人
Li-Hsien Huang; Yueh-Ting Lin; An-Jhih Su; Ming Shih Yeh; Der-Chyang Yeh
IPC分類
H01L21/56; H01L23/31; H01L25/16; H01L21/683; H01L23/00; H01L25/00
技術(shù)領(lǐng)域
die,dicing,conductive,molding,packages,in,pillars,dielectric,package,structure
地域： Hsinchu

摘要

A method includes attaching a first die and a second die to a carrier; forming a molding material between the first die and second die; and forming a redistribution structure over the first die, the second die and the molding material, the redistribution structure includes a first redistribution region; a second redistribution region; and a dicing region between the first redistribution region and the second redistribution region. The method further includes forming a first opening and a second opening in the dicing region, the first opening and the second opening extending through the redistribution structure and exposing the molding material; and separating the first die and the second die by cutting through a portion of the molding material aligned with the dicing region from a second side of the molding material toward the first side of the molding material, the second side opposing the first side.

說明書

The seal rings, however, take up space in the semiconductor structure. For example, a width of the seal ring may be about 40 μm, and areas with a total width of about 80 μm between two semiconductor packages (e.g., 1100A and 1100B) are used to form the seal rings. The present disclosure, by not forming any seal rings around the semiconductor packages (e.g., 1100A and 1100B) in the redistribution structure 140′, frees up more space to form semiconductor packages on the carrier 101. For example, about 2% or more semiconductor packages may be formed on the carrier 101 by not forming the seal rings, thus achieving higher productivity. In addition, the pre-cut process and the dicing process, disclosed hereinafter, avoid or reduce cracks/delamination in the redistribution structure 140′ without using the seal ring.

權(quán)利要求

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