In FIG. 7A, two openings 311/313 are formed by the pre-cut process, with each opening providing protection against cracking and/or delamination for an adjacent semiconductor package in a subsequent dicing process, as will be discussed in more details hereinafter with reference to FIG. 10. In particular, the opening 311 protects the redistribution structure of the semiconductor package 1100A, and the opening 313 protects the redistribution structure of the semiconductor package 1100B. Forming more than two openings between two adjacent semiconductor packages may not be necessary, since the additional opening(s), if formed, does not provide much additional protection against cracking and/or delamination of the redistribution structure 140′ during dicing. On the other hand, forming only one opening, e.g., forming only 311 or only 313, may not provide protection for one of the two adjacent semiconductor packages. Although an opening having a wide width, e.g., an opening with a width extending from 311E to 313E, may be formed between two adjacent semiconductor packages to provide protection against cracking and/or delamination, forming such a wide opening may take a significantly longer time, and/or may require laser with much higher output power. Therefore, the two openings (e.g., 311 and 313) formed between two adjacent semiconductor packages by the pre-cut process, combined with the dicing process discussed hereinafter with reference to FIG. 10, provide an efficient (e.g., shorter fabrication time, and higher productivity) and easy-to-implement manufacturing process that does not require seal rings but still provides protection against cracking and delamination.