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Method for dicing integrated fan-out packages without seal rings

專利號(hào)
US11177142B2
公開(kāi)日期
2021-11-16
申請(qǐng)人
Taiwan Semiconductor Manufacturing Company, Ltd.(TW Hsinchu)
發(fā)明人
Li-Hsien Huang; Yueh-Ting Lin; An-Jhih Su; Ming Shih Yeh; Der-Chyang Yeh
IPC分類
H01L21/56; H01L23/31; H01L25/16; H01L21/683; H01L23/00; H01L25/00
技術(shù)領(lǐng)域
die,dicing,conductive,molding,packages,in,pillars,dielectric,package,structure
地域: Hsinchu

摘要

A method includes attaching a first die and a second die to a carrier; forming a molding material between the first die and second die; and forming a redistribution structure over the first die, the second die and the molding material, the redistribution structure includes a first redistribution region; a second redistribution region; and a dicing region between the first redistribution region and the second redistribution region. The method further includes forming a first opening and a second opening in the dicing region, the first opening and the second opening extending through the redistribution structure and exposing the molding material; and separating the first die and the second die by cutting through a portion of the molding material aligned with the dicing region from a second side of the molding material toward the first side of the molding material, the second side opposing the first side.

說(shuō)明書(shū)

Next, in FIG. 10, a dicing process is performed to separate the PoP packages 500 (e.g., 500A, 500B) into a plurality of individual PoP packages. In an exemplary embodiment, a blade 315 with a width of W3 is used to dice the PoP packages. The width W3 is smaller than the width W2 measured between the sidewall 311E of the opening 311 and the sidewall 313E of the opening 313, in some embodiments. In the illustrated embodiment, the blade 315 is positioned in a center region between the sidewall 311E and the sidewall 313E, and therefore, does not overlap or contact the sidewalls 311E/313E during the dicing process. In other words, the blade 315 is laterally between the sidewall 311E and the sidewall 313E. In some embodiments, the width W3 of the blade 315 is wider than the width W4 of the remaining portion 140R of the redistribution structure 140′ disposed between the openings 311 and 313. This may allow the blade 315 to remove the remaining portion 140R in one cut to reduce the processing time of the dicing process. For example, the remaining portion 140R of the redistribution structure 140′ may be laterally between opposing vertical sidewalls of the blade 315, such that as the blade 315 cuts downward toward the redistribution structure 140′, the remaining portion 140R is removed in one cut.

權(quán)利要求

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