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Method for dicing integrated fan-out packages without seal rings

專利號
US11177142B2
公開日期
2021-11-16
申請人
Taiwan Semiconductor Manufacturing Company, Ltd.(TW Hsinchu)
發(fā)明人
Li-Hsien Huang; Yueh-Ting Lin; An-Jhih Su; Ming Shih Yeh; Der-Chyang Yeh
IPC分類
H01L21/56; H01L23/31; H01L25/16; H01L21/683; H01L23/00; H01L25/00
技術(shù)領(lǐng)域
die,dicing,conductive,molding,packages,in,pillars,dielectric,package,structure
地域: Hsinchu

摘要

A method includes attaching a first die and a second die to a carrier; forming a molding material between the first die and second die; and forming a redistribution structure over the first die, the second die and the molding material, the redistribution structure includes a first redistribution region; a second redistribution region; and a dicing region between the first redistribution region and the second redistribution region. The method further includes forming a first opening and a second opening in the dicing region, the first opening and the second opening extending through the redistribution structure and exposing the molding material; and separating the first die and the second die by cutting through a portion of the molding material aligned with the dicing region from a second side of the molding material toward the first side of the molding material, the second side opposing the first side.

說明書

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact.

Further, spatially relative terms, such as “beneath,” “below,” “l(fā)ower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

權(quán)利要求

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