As illustrated in FIG. 11, the individual PoP packages 500 has a redistribution structure 140, with the die 120 and the conductive pillars 119 electrically coupled to the upper surface of the redistribution structure 140. The molding material 130 is formed over the redistribution structure 140 around the die 120 and around the conductive pillars 119. In the example of FIG. 11, the molding material 130 extends beyond lateral extents of the redistribution structure 140. In other words, the molding material 130 is wider than, thus not conterminous with, the redistribution structure 140. For example, the molding material 130 may extend laterally beyond the boundaries (e.g., sidewalls) of redistribution structure 140 by a width W₅, which may range from about 1 μm to about 810 μm. This is due to the width W₃ of the blade 315 being smaller than the width W₂ between sidewall 311E and sidewall 313E, in some embodiments.

As illustrated in FIG. 11, an upper portion (e.g., a portion distal the redistribution structure 140) of the molding material 130 has sidewalls 130S1 that extend beyond the lateral extents of the redistribution structure 140. Further, a lower portion (e.g., a portion physically contacting the redistribution structure 140) of the molding material 130 may have sidewalls 130S2 that are aligned with the sidewalls of the redistribution structure 140, e.g., the lower portion of the molding material 130 may have a same width as the redistribution structure 140.