Variations of the disclosed embodiments are possible and are fully intended to be included within the scope of the present disclosure. For example, the number of dies 120 in each PoP package, the number and/or the location of the conductive pillars 119 in each PoP package may be modified. As another example, the dielectric layer 110 may be completely removed from the PoP package 500. As yet another example, the amount and/or shape of the underfill material 169 may be modified. For example, the underfill material 169 may be a continuous volume of dielectric material that fills the gap between the top package and the bottom package and extends continuously from a first conductive joint 168 to another conductive joint 168. Alternatively, the underfill material 169 may comprise multiple portions that are physically separated from each other, with each portion of the underfill material 169 surrounding a respective conductive joint 168.

Embodiments may achieve advantages. By omitting the seal ring in the redistribution structure, more space is available for forming the semiconductor packages, thereby achieving higher productivity. The disclosed pre-cut process and dicing process avoid or reduce cracking/delamination without the use of seal rings, thus allowing for the gain in the productivity without the problem associated with cracking and delamination.