In an embodiment, a semiconductor package includes a lower package including a die and a conductive pillar proximate the die, the die and the conductive pillar being over a redistribution structure; and a molding material over the redistribution structure, the molding material being interposed between the die and the conductive pillar, the molding material extending beyond lateral extents of the redistribution structure. In an embodiment, a first portion of the molding material extending beyond the lateral extents of the redistribution structure has a first height, and a second portion of the molding material contacting the die has a second height, where the first height is smaller than the second height. In an embodiment, the semiconductor package further includes a top package electrically coupled to the conductive pillar.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.