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Thickness measurement system and method

專利號
US11177183B2
公開日期
2021-11-16
申請人
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.（TW Hsinchu）
發(fā)明人
Yan-Hong Liu; Chien-Chih Wu; Che-Fu Chen
IPC分類
H01L21/00; H01L21/66; H01L21/67; H01L21/677; H01L21/687
技術(shù)領(lǐng)域
chamber,wafer,deposition,factory,lock,in,buffer,load,robot,process
地域： Hsinchu

摘要

A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.

說明書

Reference is made to FIG. 4. FIG. 4 is a flow chart of a method 400 for measuring the weight of the material on the wafer and converting the measured weight to the thickness of the material, according to some embodiments of the present disclosure. The method 400 includes operations S402-S424. The operations S402-S424 will be discussed with reference to FIGS. 1-3B below.

權(quán)利要求

1
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