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Thickness measurement system and method

專利號(hào)
US11177183B2
公開(kāi)日期
2021-11-16
申請(qǐng)人
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.(TW Hsinchu)
發(fā)明人
Yan-Hong Liu; Chien-Chih Wu; Che-Fu Chen
IPC分類
H01L21/00; H01L21/66; H01L21/67; H01L21/677; H01L21/687
技術(shù)領(lǐng)域
chamber,wafer,deposition,factory,lock,in,buffer,load,robot,process
地域: Hsinchu

摘要

A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.

說(shuō)明書(shū)

In operation S416, with reference to FIG. 1, the wafer in the buffer chamber 130 is transferred to the load lock chamber 120 through the valve V2 by the robot blade 132 of the robot 131 of the buffer chamber 130. Before transferring the wafer, the valves V1-V2 are closed, and the environment in the load lock chamber is kept in the second environment since the valves V1-V2 are kept closed after the operation S404. Then, after the valve V2 is open, the wafer is transferred from the buffer chamber 130 to the load lock chamber 120. For illustration in FIG. 1, the wafer is transferred from the position D or the position E in the buffer chamber 130 to the position B by the robot blade 132 of the robot 131 of the buffer chamber 130. After the wafer is transferred to the load lock chamber 120, the valve V2 is close in order to isolate the environment between the load lock chamber 120 and the buffer chamber 130.

權(quán)利要求

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