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Thickness measurement system and method

專利號
US11177183B2
公開日期
2021-11-16
申請人
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.（TW Hsinchu）
發(fā)明人
Yan-Hong Liu; Chien-Chih Wu; Che-Fu Chen
IPC分類
H01L21/00; H01L21/66; H01L21/67; H01L21/677; H01L21/687
技術(shù)領(lǐng)域
chamber,wafer,deposition,factory,lock,in,buffer,load,robot,process
地域： Hsinchu

摘要

A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.

說明書

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

權(quán)利要求

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