The multi-chamber system 100 further includes at least one measuring device 200 (shown in FIG. 2) equipped in the factory interface 110, the load lock chambers 120, the buffer chamber 130, or the combination thereof. The configuration of measuring device 200 will be discussed below with reference to FIG. 2.

In some embodiments, the measuring device 200 is configured to measure the weight of the wafer before the deposition process to the wafer. Before the deposition process performing to the wafer, the measuring device 200 measures the weight of the wafer. In some embodiments, the measuring device 200 is equipped in the factory interface 110 and measures the weight of the wafer in the factory interface 110 before the wafer is transferred to the load lock chamber 120. In some other embodiments, the measuring device 200 is equipped in the load lock chamber 120 and measures the weight of the wafer in the load lock chamber 120 before the wafer is transferred to the buffer chamber 130. In alternatively embodiments, the measuring device 200 is equipped in the buffer chamber 130 and measures the weight of the wafer in the buffer chamber 130 before the wafer is transferred to the deposition process chamber.