This Summary is provided to introduce a brief selection of disclosed concepts in a simplified form that are further described below in the Detailed Description including the drawings provided. This Summary is not intended to limit the claimed subject matter's scope.

Disclosed aspects recognize semiconductor packages having vertical semiconductor die(s) (vertical die) with solder connections that utilize at least one clip may as assembled have an uncontrolled BLT of solder resulting in clip and die tilting. The cause of these problems is recognized to be because during a solder reflow process the solder reflow tends to move the clip and the vertical die in z (height) direction causing tilt, and as a result non-uniformity in the BLT of the solder.