Pad design for reliability enhancement in packages
地域：
Hsinchu
摘要
A package includes a corner, a device die having a front side and a backside, and a molding material molding the device die therein. A plurality of redistribution lines is on the backside of the device die. The plurality of redistribution lines includes a plurality of metal pads. A polymer layer contacts the plurality of metal pads. A plurality of openings is formed in the polymer layer, with the plurality of metal pads aligned to and exposed to the plurality of openings. The plurality of openings includes a corner opening that is elongated and an additional opening farther away from the corner than the corner opening. The additional opening is non-elongated.
說(shuō)明書
This application is a divisional of U.S. patent application Ser. No. 15/882,189, entitled “Pad Design for Reliability Enhancement in Packages,” filed Jan. 29, 2018, which is a continuation of U.S. patent application Ser. No. 14/613,997, entitled “Pad Design for Reliability Enhancement in Packages,” filed Feb. 4, 2015, now U.S. Pat. No. 9,881,857 issued Jan. 30, 2018, which claims the benefit of the U.S. Provisional Application No. 62/011,432, filed Jun. 12, 2014, and entitled “Integrated Circuit Package Pad and Method of Forming Same,” which applications are hereby incorporated herein by reference.
In the packaging of integrated circuits, there are various types of packaging methods and structures. For example, in a conventional Package-on-Package (POP) process, a top package is bonded to a bottom package. The top package and the bottom package may also have device dies packaged therein. By adopting the PoP process, the integration level of the packages is increased.
In an existing PoP process, the bottom package, which includes a device die bonded to a package substrate, is formed first. A molding compound is molded to the package substrate, wherein the device die is molded in the molding compound. The package substrate further includes solder balls formed thereon, wherein the solder balls and the device die are on a same side of the package substrate. The solder balls are used for connecting the top package to the bottom package.
權(quán)利要求
What is claimed is:1. A package comprising:a device die; an encapsulant encapsulating the device die therein; a plurality of metal pads over the encapsulant; a polymer layer over the plurality of metal pads; and a plurality of solder regions penetrating through the polymer layer, wherein the plurality of solder regions contact respective ones of the plurality of metal pads to form a plurality of interfaces, and wherein the plurality of interfaces comprise:a first elongated interface, wherein the plurality of metal pads comprise a metal pad, with the first elongated interface being formed between the metal pad and a respective one of the plurality of solder regions, and wherein the metal pad has a non-elongated shape in a top view of the package, and wherein in the top view, the metal pad having the non-elongated shape extends beyond edges of the first elongated interface in all lateral directions; and a non-elongated interface. 2. The package of claim 1 , wherein the polymer layer contacts outer portions of the plurality of metal pads to form additional interfaces, and the additional interfaces surround respective ones of the plurality of interfaces. 3. The package of claim 1 , wherein the first elongate interface is closest to a corner of the package than all other interfaces formed between solder regions and metal pads, and wherein the plurality of interfaces further comprise a second elongated interface and additional non-elongated interfaces, with the second elongated interface surrounded by the additional non-elongated interfaces. 4. The package of claim 1 further comprising a through-via penetrating through the encapsulant. 5. The package of claim 4 , wherein the through-via comprises a first end portion and a second end portion, with the first end portion being between the second end portion and the polymer layer, and wherein the first end portion has substantially straight sidewalls, and the second end portion has curved sidewalls. 6. The package of claim 1 , wherein the plurality of metal pads comprise an additional metal pad, with the non-elongated interface being formed between the additional metal pad and a respective one of the plurality of solder regions, and wherein the additional metal pad has a non-elongated shape in the top view. 7. A package comprising:a device die; a molding compound encapsulating the device die therein; a plurality of through-vias in the molding compound; a first redistribution structure on a front side of, and electrically coupling to, the device die; and a second redistribution structure on a backside of the device die, wherein the second redistribution structure comprises:a plurality of metal pads electrically coupling to the first redistribution structure through the plurality of through-vias; and a plurality of solder regions contacting the plurality of metal pads to form a plurality of interfaces, wherein each of the plurality of metal pads laterally extends beyond corresponding ones of the plurality of interfaces, and wherein the plurality of interfaces comprise:a first elongated interface formed between one of the plurality of metal pads and one of the plurality of solder regions, and wherein the one of the plurality of metal pads is non-elongated, and wherein in a top view of the package, the one of the plurality of metal pads is larger than the first elongated interface, and in the top view, an outer portion of the one of the plurality of metal pads fully encircles the first elongated interface. 8. The package of claim 7 , wherein the first elongate interface has an oval shape in the top view of the package, and the one of the plurality of metal pads has a round shape in the top view of the package. 9. The package of claim 7 further comprising a dielectric layer contacting the plurality of metal pads, wherein the one of the plurality of solder regions penetrates through an elongate opening in the dielectric layer. 10. The package of claim 9 , wherein the dielectric layer comprises a polymer. 11. The package of claim 7 further comprising a die-attach film adhering a back surface of a semiconductor substrate of the device die to the second redistribution structure. 12. The package of claim 7 , wherein the first elongated interface overlaps a corner region of the device die, and the plurality of interfaces further comprise a plurality of non-elongated interfaces formed between corresponding solder regions and metal pads, and the first elongated interface is fully encircled by the plurality of non-elongated interfaces. 13. The package of claim 7 , wherein the first elongated interface is formed between an inner solder region and a corresponding metal pad, and the inner solder region is surrounded by a group of solder regions in the plurality of solder regions, and the group of solder regions form non-elongated interfaces with corresponding ones of the plurality of metal pads. 14. The package of claim 7 , wherein the elongated interface has an elongate hexagonal shape. 15. A package comprising:a device die; an encapsulant encapsulating the device die therein; a plurality of metal pads over the encapsulant; a first solder region contacting a first one of the plurality of metal pads to form a first interface, wherein the first interface is elongated and is centripetal; and a through-via penetrating through the encapsulant, wherein the through-via comprises a first end portion and a second end portion, with the first end portion being between the second end portion and the first solder region, wherein the first end portion has substantially straight sidewalls, and the second end portion has curved sidewalls, and wherein portions of the second end portion farther away from the first end portion are narrower than portions of the second end portion closer to the first end portion. 16. The package of claim 15 , wherein the device die comprises a metal pillar, and the second end portion has a first end coplanar with a second end of the metal pillar. 17. The package of claim 15 further comprising a die-attach film attached to the device die, wherein the die-attach film is in the encapsulant, and wherein a first surface of the die-attach film is coplanar with a second surface of the first end portion. 18. The package of claim 15 further comprising a second solder region contacting a second one of the plurality of metal pads to form a second interface, wherein the second interface is non-elongated. 19. The package of claim 15 , wherein the elongated interface has a long axis, and an extension line of the long axis passes through a center of the package.
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