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Pad design for reliability enhancement in packages

專利號
US11177200B2
公開日期
2021-11-16
申請人
Taiwan Semiconductor Manufacturing Co., Ltd.(TW Hsin-Chu)
發(fā)明人
Jie Chen; Hsien-Wei Chen
IPC分類
H01L23/538; H01L23/498; H01L23/544; H01L23/31; H01L23/00; H01L25/10; H01L25/00
技術(shù)領(lǐng)域
openings,elongated,158a,package,die,158b,in,pads,rdls,solder
地域: Hsinchu

摘要

A package includes a corner, a device die having a front side and a backside, and a molding material molding the device die therein. A plurality of redistribution lines is on the backside of the device die. The plurality of redistribution lines includes a plurality of metal pads. A polymer layer contacts the plurality of metal pads. A plurality of openings is formed in the polymer layer, with the plurality of metal pads aligned to and exposed to the plurality of openings. The plurality of openings includes a corner opening that is elongated and an additional opening farther away from the corner than the corner opening. The additional opening is non-elongated.

說明書

Throughout the embodiments of the present disclosure, as shown in FIGS. 2 through 9, elongated openings 158A are centripetal. In accordance with some embodiments, the longer axis 134 (FIGS. 10A and 10B) of elongated centripetal openings 158A extend toward the neutral-stress point 140 (FIG. 2 through 4), which may be at, or at least close to, the center of bottom package 100 (in the top view). Alternatively stated, the longer axis 134 (FIGS. 10A and 10B) of the centripetal elongated openings 158A pass through the center of bottom package 100, or at least, the longer axis 134 of the centripetal elongated openings 158A are closer to the center of bottom package 100 than the respective shorter axis 136.

權(quán)利要求

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