FIG. 7 illustrates the top view of a package and openings in a top dielectric layer of the package in accordance with some embodiments, wherein a plurality of inner openings adjacent to each corner of an underlying device die is elongated;

FIG. 8 illustrates the top view of a package and openings in a top dielectric layer of the package in accordance with some embodiments, wherein a plurality of inner openings adjacent to each corner of an underlying device die group is elongated;

FIG. 9 illustrates the top view of a package and openings in a top dielectric layer of the package in accordance with some embodiments, wherein openings in corner rectangular regions are elongated;

FIGS. 10A and 10B illustrate top views of some exemplary elongated openings;

FIGS. 11A and 11B illustrate top views of some exemplary non-elongated openings in accordance with some embodiments;

FIGS. 12A and 12B illustrate the exemplary shapes of elongated openings and their respective underlying metal pads in accordance with some embodiments; and

FIG. 13 illustrates the metal pads on a package that is bonded to the package with elongated openings.