The conversion element 102 is configured for at least partial conversion of the primary radiation emitted by the semiconductor chip 101 into electromagnetic secondary radiation. In other words, the conversion element 102 is configured in order to convert the radiation emitted by the semiconductor chip 101 partially or fully into further radiation having a different, in particular longer, wavelength than the emitted radiation.

The conversion element 102 is in this case subdivided into individual portions. The conversion element 102 is, in particular, subdivided into at least two portions 103. The portions 103 are in this case discrete from one another, i.e. they are not in contact with one another and do not touch.

In the first embodiment, all the portions 103 have the same geometrical shape, and in particular are cuboid or approximately cuboid in the scope of manufacturing tolerances. The portions 103 also have the same size, i.e. the same volume and the same edge lengths. According to the first embodiment, the portions 103 are arranged equidistantly, i.e. with equal distances from one another.