The optical element 104 has a thickness of less than 500 μm, such as less than 200 μm, such as a thickness of 100 μm. The small overall height of the optical element 104 is achieved in particular by the use of optical microelements. In this way, a small overall height of the optoelectronic component 100 is achieved overall.
Advantageously, the portions 103 and the microlenses 105 are arranged in such a way that each portion 103 is assigned a microlens 105. In this way, a particularly uniform emission characteristic is achieved. The portions 103 may lie in particular, respectively at the focal point or approximately at the focal point of the assigned microlenses 105.
As an alternative, the microlenses 105, or selectively chosen individual microlenses 105, may also be arranged offset with respect to the portions 103 of the conversion element 102, in order to achieve a lateral offset of the emission and therefore controlled or enhanced illumination of particular regions. This allows great flexibility in the external appearance of the optoelectronic component 100.