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Optoelectronic component, a module having at least two optoelectronic components, and a method for producing an optoelectronic component

專利號
US11177416B2
公開日期
2021-11-16
申請人
OSRAM OLED GmbH(DE Regensburg)
發(fā)明人
Peter Brick; Ulrich Streppel; Christopher Wiesmann
IPC分類
H01L33/50; H01L33/60
技術(shù)領(lǐng)域
chip,radiation,element,conversion,optical,in,component,emission,portions,or
地域: Regensburg

摘要

An optoelectronic component may include at least one semiconductor chip for emitting electromagnetic radiation, a conversion element, and an optical element. The conversion element may at least partially convert primary radiation emitted by the semiconductor chip(s) into secondary radiation where the conversion element is arranged downstream of the semiconductor chip(s) in the emission direction and is arranged on the semiconductor chip(s). The optical element may be arranged downstream of the conversion element in the emission direction and where the conversion element is subdivided into individual portions.

說明書

FIG. 2 shows a schematic representation of the beam path of the electromagnetic radiation inside an optoelectronic component 100 according to the first embodiment. Depending on the configuration, the optical element 104 directs the emitted radiation 110 into different regions of the target region. In the present embodiment, the emitted radiation 110 is distributed uniformly over the target region by the use of a microlens array, i.e. into the corners, onto the edge and into the center.

The optical element 104 has a thickness of less than 500 μm, such as less than 200 μm, such as a thickness of 100 μm. The small overall height of the optical element 104 is achieved in particular by the use of optical microelements. In this way, a small overall height of the optoelectronic component 100 is achieved overall.

Advantageously, the portions 103 and the microlenses 105 are arranged in such a way that each portion 103 is assigned a microlens 105. In this way, a particularly uniform emission characteristic is achieved. The portions 103 may lie in particular, respectively at the focal point or approximately at the focal point of the assigned microlenses 105.

As an alternative, the microlenses 105, or selectively chosen individual microlenses 105, may also be arranged offset with respect to the portions 103 of the conversion element 102, in order to achieve a lateral offset of the emission and therefore controlled or enhanced illumination of particular regions. This allows great flexibility in the external appearance of the optoelectronic component 100.

權(quán)利要求

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