In all the embodiments, the distance between the emission face 107 of the semiconductor chip 101 and the optical element 104 is less than 500 μm, such as less than 200 μm.

FIG. 4 shows a schematic representation of a perspective view of the optoelectronic component 100 according to the first exemplary embodiment. The optoelectronic component 100 in this case also includes a housing 130, in which the semiconductor chip 101 is arranged and which as a cover section includes the optical element 104 consisting of the optical microelements 105. In this first embodiment, convex microlenses 105 are provided as optical microelements 105. However, any other lens shape may also be envisioned, for example spherical, aspherical, conical, toroidal, biconical, freeform or any other lens shape. The microlenses 105 image the end of the portions 102 into the far-field.

Furthermore, FIG. 4 shows a square arrangement of the microlenses 105, although any other arrangement may also be envisioned, for example rectangular, hexagonal or a Fibonacci arrangement. The microlenses 105 may also be arranged statistically distributed.