FIG. 5 shows a schematic representation of a cross section of an optoelectronic component 300 according to a third embodiment.

The optoelectronic component 300 according to the third embodiment includes an optical element 304, which includes microreflectors 305 or other reflective elements as optical microelements. The microreflectors 305 may in this case have any shape, for example elliptical, parabolic or spherical. Furthermore, the microreflectors may be configured as concave mirrors with a reflective coating, or also as a TIR (total internal reflection) reflector, for example a CPC (compound parabolic concentrator).

According to the third embodiment, the microreflectors 305 are configured as conic frustums. The reflective materials are selected in such a way that a material with a high refractive index is provided inside the reflector and a material with a low refractive index is provided outside the reflector. For example, the conic frustums may consist of solid material such as polymer, silicone or epoxy. As an alternative, the reflectors may have a particular wall thickness with a coating on the interface.

FIGS. 6 to 8 show schematic representations of a cross section of an optoelectronic component according to a fourth, fifth and sixth embodiment.

The embodiments of FIGS. 6 to 8 in this case correspond to the first embodiment, with the exception of the semiconductor chip used.