FIG. 9 shows an optoelectronic component 700 according to a seventh embodiment, in which the semiconductor chip 701 is constructed as in the fourth embodiment. That is to say, the semiconductor chip 701 consists of a radiation-emitting layer 702, or epi layer, which is applied on a substrate 703 or carrier. The substrate 703 is in this case arranged between the radiation-emitting layer 702 and the conversion element 102. The substrate is transparent or radiation-transmissive. Any other configuration, described in this application, of the semiconductor chip 701 may, however, also be envisioned.

In this seventh embodiment, the component 700 includes a first optical element 704 and a second optical element 714. The optical elements 704, 714 in this case include optical microlenses 705, 715, although any other configuration of the optical elements 704, 714 is also possible. In particular, the two optical elements 704, 714 may include different types of optical microelements. The two optical elements 704, 714 may also be formed in one piece, in particular without an interface.