In the seventh to ninth embodiments, the materials for the respective encapsulation 730, 731, 830, 930 and for the optical element 704, 714, 804, 904 are selected in such a way that maximally low-loss output of the radiation from the optoelectronic component can take place, i.e. with the lowest possible losses, for example by total reflection. The material for the encapsulation 730, 731, 830, 930 is therefore a material having a low refractive index, such as having a refractive index of less than 1.55. The material for the optical element 704, 714, 804, 904 is a material having a high refractive index, such as having a refractive index of more than 1.55.

FIG. 12 shows a schematic sequence of a method for producing the optoelectronic component. The description of the method is carried out by way of example with the aid of the first embodiment, although it may naturally be applied with corresponding adaptation to any other embodiment described here.