In particular, all described semiconductor chips may be combined with all described types of optical elements, with and without encapsulation, and the optoelectronic components relates are not restricted to the presented combinations of semiconductor chips and optical elements.
Even though the method for producing an optoelectronic component are described in a particular order, it is clear that each of the methods described in this disclosure may be carried out in any other expedient order, and method aspects or limitations may be omitted or added so long as the underlying concept of the technical teaching described is not departed from.