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Optoelectronic component, a module having at least two optoelectronic components, and a method for producing an optoelectronic component

專利號(hào)
US11177416B2
公開日期
2021-11-16
申請(qǐng)人
OSRAM OLED GmbH(DE Regensburg)
發(fā)明人
Peter Brick; Ulrich Streppel; Christopher Wiesmann
IPC分類
H01L33/50; H01L33/60
技術(shù)領(lǐng)域
chip,radiation,element,conversion,optical,in,component,emission,portions,or
地域: Regensburg

摘要

An optoelectronic component may include at least one semiconductor chip for emitting electromagnetic radiation, a conversion element, and an optical element. The conversion element may at least partially convert primary radiation emitted by the semiconductor chip(s) into secondary radiation where the conversion element is arranged downstream of the semiconductor chip(s) in the emission direction and is arranged on the semiconductor chip(s). The optical element may be arranged downstream of the conversion element in the emission direction and where the conversion element is subdivided into individual portions.

說明書

According to one embodiment, the optical element is an array of a multiplicity of optical microelements. In this way, the optical element can be made particularly thin, so that the optoelectronic component has a small overall height. The use of micro-optics, i.e. an array of a multiplicity of optical microelements, is only made possible at all by the spatial subdivision of the conversion element into portions. The portions therefore cooperate advantageously with the micro-optics.

According to one non-limiting embodiment, each portion of the conversion element is assigned an optical microelement. In this way, a portion of the conversion element and an optical microelement may respectively be oriented in such a way that the portion of the conversion element lies at the focal point or close to the focal point of the optical microelement. In this way, the radiation generated by the conversion element can be directed particularly effectively and free from loss into the target region.

According to one embodiment, the optical element may form an array of microlenses.

In an alternative embodiment, the optical element may form an array of microreflectors.

According to one embodiment, the optical element is arranged at a distance from the conversion element. By the additional interface for refraction of the radiation emitted by the semiconductor chip, the losses in the optical element can be reduced. In this way, the efficiency of the component is increased and the light can be imaged better into the target region.

權(quán)利要求

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