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Optoelectronic component, a module having at least two optoelectronic components, and a method for producing an optoelectronic component

專利號(hào)
US11177416B2
公開日期
2021-11-16
申請人
OSRAM OLED GmbH（DE Regensburg）
發(fā)明人
Peter Brick; Ulrich Streppel; Christopher Wiesmann
IPC分類
H01L33/50; H01L33/60
技術(shù)領(lǐng)域
chip,radiation,element,conversion,optical,in,component,emission,portions,or
地域： Regensburg

摘要

An optoelectronic component may include at least one semiconductor chip for emitting electromagnetic radiation, a conversion element, and an optical element. The conversion element may at least partially convert primary radiation emitted by the semiconductor chip(s) into secondary radiation where the conversion element is arranged downstream of the semiconductor chip(s) in the emission direction and is arranged on the semiconductor chip(s). The optical element may be arranged downstream of the conversion element in the emission direction and where the conversion element is subdivided into individual portions.

說明書

According to one embodiment, the optoelectronic component includes a planar upper side, which is formed by the optical element or by encapsulation. In this way, in particular, the further processing is simplified since the planar surface can be damaged less easily. For example, application of protective glass is not necessary.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the illumination apparatus.

In the following description, various aspects are described with reference to the following drawings, in which:

FIG. 1 shows a schematic representation of a cross section of an optoelectronic component according to a first embodiment;

FIG. 2 shows a schematic representation of the beam path of the electromagnetic radiation inside an optoelectronic component according to the first embodiment;

FIG. 3 shows a schematic representation of a cross section of an optoelectronic component according to a second embodiment;

FIG. 4 shows a schematic representation of a perspective view of the optoelectronic component according to the first embodiment;

FIG. 5 shows a schematic representation of a cross section of an optoelectronic component according to a third embodiment;

權(quán)利要求

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