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Flexible display device and manufacturing method

專利號
US11177448B2
公開日期
2021-11-16
申請人
BOE TECHNOLOGY GROUP CO., LTD.(CN Beijing)
發(fā)明人
Shuai Zhang; Yueping Zuo; Libin Liu
IPC分類
H01L51/56; H01L51/00; H01L27/32
技術(shù)領(lǐng)域
layer,flexible,cutting,etching,region,display,tft,substrate,etch,bending
地域: Beijing

摘要

The present disclosure provides a flexible display device and a manufacturing method. The manufacturing method includes: forming a layer of flexible display devices on a support plate; etching the layer of flexible display devices on the support plate to expose a portion of the support plate at a cutting region, the cutting region being a predetermined region between two adjacent flexible display devices; and removing the layer of flexible display devices from the support plate after the etching process so as to obtain a plurality of flexible display devices separated from each other.

說明書

According to the method in the embodiments of the present disclosure, the layer of flexible display devices may be formed on the glass support plate 3 at first. Next, a portion of each layer at the cutting region 1 between two adjacent flexible display devices may be removed through an etching process, so as to separate the flexible display devices from each other. Finally, each etched flexible display device may be removed from the glass support plate 3 through an LLO process, so as to obtain a plurality of flexible display devices separated from each other. Hence, during the manufacture of the flexible display device using the method in the embodiments of the present disclosure, the display devices may be separated from each other through an etching process, and as compared with the related art where a laser cutting process is adopted, it is able to provide a smaller cutting width, and accurately control a bezel of each display device. In a word, through the method in the embodiments of the present disclosure, it is able to provide the product with an ultra-narrow bezel while ensuring the quality of the display device.

In some embodiments of the present disclosure, the process of removing the portion of each layer at the cutting region 1 through an etching process may be performed at any appropriate time according to the practical need. For example, the portion of each layer at the cutting region 1 may be removed through an etching process after the formation of the layer covering the cutting region 1. Also, the portions of at least two layers at the cutting region 1 may be removed through an etching process after the formation of the at least two layers covering the cutting region 1.

權(quán)利要求

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