In a first mode, portions of the TFT array layer 6 and the buffer layer 5 at the cutting region 1 and the bending region 2 may be removed through a single etching process, as shown in FIG. 1b. In a second mode, after the removal of the portions of the TFT array layer 6 at the cutting region 1 and the bending region 2 through an etching process, the portions of the buffer layer 5 at the cutting region 1 and the bending region 2 may be removed through another etching process.

When the portion of the buffer layer 5 at the cutting region 1 is removed in the first mode, it is unnecessary to provide any additional etching process for removing the buffer layer 5, so it is able to simplify the separation of the adjacent flexible display devices from each other. When the buffer layer 5 is removed in the second mode, it is able to etch the portions of the TFT array layer 6 and the buffer layer 5 at the cutting region 1 and the bending region 2 with improved accuracy.

In some embodiments of the present disclosure, the step of forming the plurality of layers on the flexible substrate 4 may include forming the organic material layer 7 on the TFT array layer 6.