In some embodiments of the present disclosure, during the manufacture of the flexible display device, it is necessary to etch the layers at the bending region 2 twice. In order to reduce the number of the etching processes and reduce the manufacture cost, the layers at the cutting region 1 may be etched when etching the layers at the bending region 2 for the first time and the second time. For example, subsequent to the formation of the buffer layer 5 and the TFT array layer 6 on the flexible substrate 4, a first etching process at the cutting region 1 may be performed at the same time with a first etching process at the bending region, so as to remove the portion of the TFT array layer 6 at the cutting region 1, thereby to expose the buffer layer 5.

Next, a second etching process at the cutting region 1 may be performed at the same time with a second etching process at the bending region 2, so as to remove the portion of the buffer layer 5 at the cutting region 1, thereby to expose the flexible substrate 4 under the buffer layer 5.

The step of forming the organic material layer 7 on the TFT array layer 6 may be performed between the first etching process and the second etching process, i.e., the organic material layer 7 may be formed after removal of the portion of the TFT array layer 6 at the cutting region 1 and exposure of the buffer layer 5. Otherwise, the organic material layer 7 may be formed after the second etching process, i.e., after the removal of the portion of the buffer layer 5 at the cutting region 1.