During the manufacture process of the display device, the portion of the organic material layer 7 at the cutting region 1 may be removed through exposing with a mask plate, so the step of forming the organic material layer 7 may be performed at any appropriate time according to the practical need.

The step of forming the encapsulation layer 8 may be performed after the second etching process.

After the second etching process at the bending region 2, the etching treatment at the bending region 2 may be completed. Next, it is necessary to further etch the layers at the cutting region 1. For example, the portions of the encapsulation layer 8 and the flexible substrate 4 may be removed through a single etching process, so as to expose the portion of the glass support plate 3 at the cutting region 1. At this time, the flexible display devices have been separated from each other, and each flexible display device is attached onto the glass support plate 3. Then, each display device with a narrow bezel can be removed from the glass support plate through an LLO process.