In a possible embodiment of the present disclosure, forming the plurality of layers on the flexible substrate includes: forming the etch stop layer and the gate electrode layer of the TFT array layer through a single patterning process; or forming the etch stop layer and the source electrode layer and the drain electrode layer of the TFT array layer through a single patterning process.

In a possible embodiment of the present disclosure, the etch stop layer includes a first metal layer and a second metal layer. The step of forming the plurality of layers on the flexible substrate includes: forming the first metal layer of the etch stop layer and the gate electrode layer of the TFT array layer through a first patterning process; and forming the second metal layer of the etch stop layer and the source electrode layer and the drain electrode layer of the TFT array layer through a second patterning process.

In a possible embodiment of the present disclosure, prior to forming the TFT array layer on the flexible substrate, the method further includes forming a buffer layer on the flexible substrate.

In a possible embodiment of the present disclosure, forming the plurality of layers on the flexible substrate includes forming an organic material layer on the TFT array layer.

In a possible embodiment of the present disclosure, forming the plurality of layers on the flexible substrate includes forming an encapsulation layer on the organic material layer.

In a possible embodiment of the present disclosure, etching the layer of flexible display devices to expose the portion of the support plate at the cutting region includes etching off a portion of each layer and a portion of the flexible substrate, so as to expose the portion of the support plate at the cutting region.