In a possible embodiment of the present disclosure, etching the layer of flexible display devices on the support plate so as to expose the portion of the support plate at the cutting region includes removing a portion of the TFT array layer at the cutting region and a portion of the TFT array layer at the bending region through a single etching process.

In a possible embodiment of the present disclosure, subsequent to removing the portion of the TFT array layer at the cutting region and the portion of the TFT array layer at the bending region through a single etching process, the method further includes removing a portion of the buffer layer at the cutting region and a portion of the buffer layer at the bending region through a single etching process.

In a possible embodiment of the present disclosure, etching the layer of flexible display devices on the support plate so as to expose the portion of the support plate at the cutting region includes removing a portion of the organic material layer at the cutting region and a portion of the organic material layer at the bending region through an exposing process.

In a possible embodiment of the present disclosure, subsequent to the removing the portion of the buffer layer at the cutting region and the portion of the buffer layer at the bending region through a single etching process, the method further includes removing a portion of the encapsulation layer and a portion of the flexible substrate at the cutting region and a portion of the encapsulation layer at the bending region through a single etching process, so as to expose the portion of the support plate at the cutting region.