The present disclosure will be described hereinafter in conjunction with the embodiments and drawings.

As shown in FIGS. 1a to 1e, the present disclosure provides in some embodiments a method for manufacturing a flexible display device adapted to a mainstream manufacture process for the flexible display device. Generally, a flexible polyimide (PI) film is formed on a rigid substrate (usually a glass support plate), and then functional layers, e.g., a TFT layer, an OLED layer and an encapsulation layer, are formed on the PI film, so as to obtain the flexible display device.

Subsequent to the formation of a display panel including the above-mentioned functional layers on the PI film, the PI film may be removed from the glass support plate through an LLO process, so as to obtain the display panel with the PI film as a flexible substrate. Typically, during the LLO process, the flexible display panel is irradiated with a laser beam from a side where the glass support plate is located, so as to destroy an intermolecular force between the flexible PI substrate and the glass support plate, thereby to effectively separate the PI substrate from the glass support plate.

During the manufacture of the conventional flexible display device, usually a plurality of display devices manufactured as a whole is removed from the glass support plate, and then cut into the flexible display devices separated from each other through a laser cutting operation. As pointed out in the background, it is necessary to provide a certain cutting margin for the laser cutting process, so it is impossible to provide a product with an ultra-arrow bezel while ensuring the quality of the display device.