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Light-emitting element encapsulation structure, method for fabricating the same and display panel

專利號
US11177459B2
公開日期
2021-11-16
申請人
Hefei Xinsheng Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.(CN Anhui CN Beijing)
發(fā)明人
Shihlun Chen; Litao Qu
IPC分類
H01L51/52; H01L51/56
技術(shù)領(lǐng)域
emitting,substrate,layer,element,light,absorbent,in,disclosure,glue,first
地域: Anhui

摘要

Disclosed are a light-emitting element encapsulation structure, a method for fabricating the same, and a display panel, and the light-emitting element encapsulation structure includes: a first substrate; a second substrate arranged opposite to the first substrate; a light-emitting element located on the side of the second substrate facing the first substrate; an encapsulation layer made of a water-absorbent material, and filled in edge areas of the first substrate and the second substrate, wherein a hermetic space is defined by the encapsulation layer, the first substrate, and the second substrate, and the light-emitting element is located in the hermetic space; and a filler; the hermetic space is full of the filler except for an area occupied by the light-emitting element.

說明書

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, as illustrated in FIG. 3 and FIG. 4, the light-emitting element encapsulation structure can include a display area AA (an area including an orthographic projection of the light-emitting element 5 onto the first substrate 01), a first peripheral area S1 located around the display area AA and surrounding the display area AA, and a second peripheral area S2 located around the first peripheral area S1 and surrounding the first peripheral area S1, where a non-display area can optionally include the first peripheral area S1 and the second peripheral area S2, and the encapsulation layer 3 is arranged in the non-display area, and can optionally be only arranged in a part of the non-display area, e.g., in the second peripheral area S2, or can be arranged in both the second peripheral area S2, and a part of the first peripheral area S1.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, as illustrated in FIG. 3 and FIG. 4, the distance d between an orthographic projection of the encapsulation layer 3 onto the first substrate 1, and an orthographic projection of the light-emitting element 5 onto the first substrate 1 is less than or equal to 0.5 mm.

權(quán)利要求

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