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Light-emitting element encapsulation structure, method for fabricating the same and display panel

專利號(hào)
US11177459B2
公開日期
2021-11-16
申請(qǐng)人
Hefei Xinsheng Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.(CN Anhui CN Beijing)
發(fā)明人
Shihlun Chen; Litao Qu
IPC分類
H01L51/52; H01L51/56
技術(shù)領(lǐng)域
emitting,substrate,layer,element,light,absorbent,in,disclosure,glue,first
地域: Anhui

摘要

Disclosed are a light-emitting element encapsulation structure, a method for fabricating the same, and a display panel, and the light-emitting element encapsulation structure includes: a first substrate; a second substrate arranged opposite to the first substrate; a light-emitting element located on the side of the second substrate facing the first substrate; an encapsulation layer made of a water-absorbent material, and filled in edge areas of the first substrate and the second substrate, wherein a hermetic space is defined by the encapsulation layer, the first substrate, and the second substrate, and the light-emitting element is located in the hermetic space; and a filler; the hermetic space is full of the filler except for an area occupied by the light-emitting element.

說明書

It shall be noted that in the light-emitting element encapsulation structure according to some embodiments of this disclosure, as illustrated in FIG. 4 to FIG. 6, there is some distance between the orthographic projection of the encapsulation layer 3 onto the first substrate 1, and the orthographic projection of the light-emitting element 5 onto the first substrate 1, that is, when the encapsulation layer 3 is bonded on the side of the first substrate 1 facing the second substrate 2, there is some distance d between the orthographic projection of the encapsulation layer 3 onto the first substrate 1, and the orthographic projection of the light-emitting element 5 onto the first substrate 1, but after the first substrate 1 is aligned, pressed, and fit with the second substrate 2, as illustrated in FIG. 5 and FIG. 6, the encapsulation layer 3 and the transparent filler 4 are expanded upon being pressed, so the distance between the orthographic projection of the encapsulation layer 3 onto the first substrate 1, and the orthographic projection of the light-emitting element 5 onto the first substrate 1 is shortened, and thus the encapsulation layer 3 is joined seamlessly with the transparent filler 4, thus better encapsulating the light-emitting element 5.

權(quán)利要求

1
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