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Light-emitting element encapsulation structure, method for fabricating the same and display panel

專利號
US11177459B2
公開日期
2021-11-16
申請人
Hefei Xinsheng Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.(CN Anhui CN Beijing)
發(fā)明人
Shihlun Chen; Litao Qu
IPC分類
H01L51/52; H01L51/56
技術(shù)領(lǐng)域
emitting,substrate,layer,element,light,absorbent,in,disclosure,glue,first
地域: Anhui

摘要

Disclosed are a light-emitting element encapsulation structure, a method for fabricating the same, and a display panel, and the light-emitting element encapsulation structure includes: a first substrate; a second substrate arranged opposite to the first substrate; a light-emitting element located on the side of the second substrate facing the first substrate; an encapsulation layer made of a water-absorbent material, and filled in edge areas of the first substrate and the second substrate, wherein a hermetic space is defined by the encapsulation layer, the first substrate, and the second substrate, and the light-emitting element is located in the hermetic space; and a filler; the hermetic space is full of the filler except for an area occupied by the light-emitting element.

說明書

Optionally, the encapsulation layer in the related art is made of a formulated viscous glue material in an irregular shape; and the encapsulation layer in some embodiments of this disclosure is a sheet made of a glue material, which can be arranged so that the encapsulation layer has a larger width, and a larger contact area with another film, so there will be a more uniform force-accepting area upon being pressed and fit under the same pressure to thereby avoid the other film from being damaged upon being pressed and fit.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, as illustrated in FIG. 7, the encapsulation layer 3 includes a water-absorbent material layer 33 and a glue material layer 34.

The glue material layer 34 is located between the water-absorbent material layer 33 and the second substrate.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the glue material layer is located between the water-absorbent material layer and the second substrate, that is, the water-absorbent material layer is located on the side of the glue material layer away from the second substrate, so the water-absorbent material layer is generally made of calcium oxide or another water-absorbent material, and shall be arranged away from the second substrate (on which a line for controlling the light-emitting element is arranged) to thereby avoid the line on the second substrate from being affected.

權(quán)利要求

1
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