Here before the encapsulation layer is fit with the first substrate and the second substrate, as illustrated in FIG. 8, a first protective film 31 is fit on the side of the water-absorbent material layer 33 away from the glue material layer 34, and a second protective film 32 is fit on the side of the glue material layer 34 away from the water-absorbent material layer 33.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the material of the glue material layer includes epoxy resin and rubber resin, and the material of the water-absorbent material layer includes calcium oxide.

Optionally, the traditional glue material generally includes epoxy resin, and is rigid, so it tends to damage another film after being cured, and for example, it may damage an OLED film (e.g., an EL organic film, a cathode Al film, etc.), a CVD film, etc., so the traditional glue material can only be located in the outermost edge areas of the first substrate and the second substrate (e.g., the second peripheral area), and it has a small width so as not to damage the other film. In some embodiments of this disclosure, the material of the glue material layer includes epoxy resin and rubber resin, and is soft, so it will not damage any other film. Accordingly in some embodiments of this disclosure, the width of the glue material can be set large (cover both the first peripheral area and the second peripheral area) to thereby improve the resistance thereof to humidity and oxygen.