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Light-emitting element encapsulation structure, method for fabricating the same and display panel

專利號
US11177459B2
公開日期
2021-11-16
申請人
Hefei Xinsheng Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.(CN Anhui CN Beijing)
發(fā)明人
Shihlun Chen; Litao Qu
IPC分類
H01L51/52; H01L51/56
技術領域
emitting,substrate,layer,element,light,absorbent,in,disclosure,glue,first
地域: Anhui

摘要

Disclosed are a light-emitting element encapsulation structure, a method for fabricating the same, and a display panel, and the light-emitting element encapsulation structure includes: a first substrate; a second substrate arranged opposite to the first substrate; a light-emitting element located on the side of the second substrate facing the first substrate; an encapsulation layer made of a water-absorbent material, and filled in edge areas of the first substrate and the second substrate, wherein a hermetic space is defined by the encapsulation layer, the first substrate, and the second substrate, and the light-emitting element is located in the hermetic space; and a filler; the hermetic space is full of the filler except for an area occupied by the light-emitting element.

說明書

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the encapsulation layer further includes a water-absorbent layer of color changing property located on the side of the water-absorbent material layer away from the second substrate.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the water-absorbent layer of color changing property can be arranged to improve the waterproof performance of the encapsulation layer, and since the color of the water-absorbent layer of color changing property will vary after it absorbs water, a humidity penetration path can be determined more intuitively to thereby analyze a reason for a failure of the encapsulation layer, and determine when it may fail.

Optionally in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the material of the transparent filler includes a water-absorbent material.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, a transparent filler is arranged between the light-emitting element and the first substrate, and the transparent filler can be made of a glue material, or another water-absorbent material with a high transmittivity to thereby prevent humidity and oxygen from eroding the light-emitting element, but also planarize them, and make the display area and the peripheral areas uniform in thickness while increasing the substrate spacing. An orthographic projection of the transparent filler onto the first substrate covers at least the orthographic projection of the light-emitting element onto the first substrate.

權利要求

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