Based upon the same inventive idea, as illustrated in FIG. 9, some embodiments of this disclosure further provides a method for fabricating a light-emitting element encapsulation structure, where the method includes the following steps.

The step S901 is to bond an encapsulation layer in an edge area of a first substrate, where the material of the encapsulation layer includes a water-absorbent material.

Optionally, bonding the encapsulation layer in the edge area of the first substrate includes:

• • bonding a first protective film and a second protective film respectively on upper and lower surfaces of the encapsulation layer;
  • placing the encapsulation layer bonded with the first protective film and the second protective film into grooves of a jig, where the second protective film comes into contact with the bottoms of the grooves;
  • removing the first protective film of the encapsulation layer;
  • aligning and fitting the jig carrying the encapsulation layer with the first substrate; and
  • removing the jig.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the encapsulation layer can be fit on the first substrate through the jig including the grooves to thereby avoid the narrow strip-shaped encapsulation layer from failing to be bonded, and the precision from being difficult to control.