The step S902 is to fill a transparent filler in a semi-hermetic area defined by the first substrate and the encapsulation layer.

The step S903 is to align and fit the first substrate with a second substrate including a light-emitting element.

Optionally, aligning and fitting the first substrate with the second substrate including the light-emitting element includes:

• • removing the second protective film; and
  • aligning and fitting the first substrate bonded with the encapsulation layer and filled with the transparent filler, with the second substrate.

Optionally, after the first substrate is aligned and fit with the second substrate including the light-emitting element, the method further includes:

• • thermally pressing and fitting, and thermally curing the encapsulation layer between the first substrate and the second substrate aligned and fit with each other.

In order to make the method for fabricating a light-emitting element encapsulation structure according to some embodiments of this disclosure more apparent, the method for fabricating a light-emitting element encapsulation structure according to some embodiments of this disclosure will be described below in details with reference to FIG. 10 to FIG. 17, where a plurality of light-emitting elements are encapsulated concurrently using a jig according to some embodiments of this disclosure.