As illustrated in FIG. 10, a jig 7 including grooves 8 is prepared.
As illustrated in FIG. 11, the encapsulation layer 3 bonded with the first protective film 31 and the second protective film 32 is placed into the grooves 8 of the jig 7, and the second protective film 32 comes into contact with the bottoms of the grooves 8. It shall be noted that one or more light-emitting elements can be encapsulated concurrently in a particular fabrication process, although some embodiments of this disclosure will not be limited thereto.
As illustrated in FIG. 12, the first protective film 31 of the encapsulation layer is removed.
As illustrated in FIG. 13, the jig 7 carrying the encapsulation layer 3 is aligned and fit with the first substrate 1 (which can optionally be a glass package substrate).
As illustrated in FIG. 14, the jig 7 is removed, and the first substrate 1 is flipped.
As illustrated in FIG. 15, the second protective film 32 is removed.
As illustrated in FIG. 16, the transparent filler 4 is filled in the semi-hermetic area defined by the first substrate 1 and the encapsulation layer 3.
As illustrated in FIG. 17, the first substrate 1 is aligned with the second substrate 2 including the light-emitting element.
