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Light-emitting element encapsulation structure, method for fabricating the same and display panel

專利號(hào)
US11177459B2
公開日期
2021-11-16
申請(qǐng)人
Hefei Xinsheng Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.(CN Anhui CN Beijing)
發(fā)明人
Shihlun Chen; Litao Qu
IPC分類
H01L51/52; H01L51/56
技術(shù)領(lǐng)域
emitting,substrate,layer,element,light,absorbent,in,disclosure,glue,first
地域: Anhui

摘要

Disclosed are a light-emitting element encapsulation structure, a method for fabricating the same, and a display panel, and the light-emitting element encapsulation structure includes: a first substrate; a second substrate arranged opposite to the first substrate; a light-emitting element located on the side of the second substrate facing the first substrate; an encapsulation layer made of a water-absorbent material, and filled in edge areas of the first substrate and the second substrate, wherein a hermetic space is defined by the encapsulation layer, the first substrate, and the second substrate, and the light-emitting element is located in the hermetic space; and a filler; the hermetic space is full of the filler except for an area occupied by the light-emitting element.

說明書

In the light-emitting element encapsulation structure, the method for fabricating the same, and the display panel according to the embodiments of this disclosure, the encapsulation layer is arranged in the edge areas of the first substrate and the second substrate in the light-emitting element encapsulation structure, where the encapsulation layer is made of the water-absorbent material; and since ambient humidity, oxygen, etc., generally enters the light-emitting element from the sides of the encapsulation structure of the light-emitting element, the first substrate and the second substrate are filled with the encapsulation layer including at least the water-absorbent material in some embodiments of this disclosure so that the ambient humidity, oxygen, etc., can be further prevented from entering the light-emitting element from the sides of the encapsulation structure, so as to prolong the service lifetime of the light-emitting element. Furthermore the film overlying the light-emitting element is a transparent filler, and in this structure, the light-emitting element can be embodied as a top-emitting element.

Evidently those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Thus the invention is also intended to encompass these modifications and variations thereto so long as the modifications and variations come into the scope of the claims appended to the invention and their equivalents.

權(quán)利要求

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