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Light-emitting element encapsulation structure, method for fabricating the same and display panel

專利號
US11177459B2
公開日期
2021-11-16
申請人
Hefei Xinsheng Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.(CN Anhui CN Beijing)
發(fā)明人
Shihlun Chen; Litao Qu
IPC分類
H01L51/52; H01L51/56
技術(shù)領(lǐng)域
emitting,substrate,layer,element,light,absorbent,in,disclosure,glue,first
地域: Anhui

摘要

Disclosed are a light-emitting element encapsulation structure, a method for fabricating the same, and a display panel, and the light-emitting element encapsulation structure includes: a first substrate; a second substrate arranged opposite to the first substrate; a light-emitting element located on the side of the second substrate facing the first substrate; an encapsulation layer made of a water-absorbent material, and filled in edge areas of the first substrate and the second substrate, wherein a hermetic space is defined by the encapsulation layer, the first substrate, and the second substrate, and the light-emitting element is located in the hermetic space; and a filler; the hermetic space is full of the filler except for an area occupied by the light-emitting element.

說明書

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the encapsulation layer further includes a water-absorbent layer of color changing property located on the a of the water-absorbent material layer away from the first substrate.

Optionally, in the light-emitting element encapsulation structure according to some embodiments of this disclosure, the material of the transparent filler includes a water-absorbent material.

Some embodiments of this disclosure further provide a method for fabricating a light-emitting element encapsulation structure, the method including:

    • bonding an encapsulation layer in an edge area of a first substrate, wherein the material of the encapsulation layer includes a water-absorbent material;
    • filling a transparent filler in a semi-hermetic area defined by the first substrate and the encapsulation layer; and
    • aligning and fitting the first substrate with a second substrate including a light-emitting element.

Optionally, in the method for fabricating a light-emitting element encapsulation structure according to some embodiments of this disclosure, the bonding the encapsulation layer in the edge area of the first substrate includes:

    • bonding a first protective film and a second protective film respectively on upper and lower surfaces of the encapsulation layer;

權(quán)利要求

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