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Light-emitting element encapsulation structure, method for fabricating the same and display panel

專利號
US11177459B2
公開日期
2021-11-16
申請人
Hefei Xinsheng Optoelectronics Technology Co., Ltd.; BOE Technology Group Co., Ltd.（CN Anhui CN Beijing）
發(fā)明人
Shihlun Chen; Litao Qu
IPC分類
H01L51/52; H01L51/56
技術領域
emitting,substrate,layer,element,light,absorbent,in,disclosure,glue,first
地域： Anhui

摘要

Disclosed are a light-emitting element encapsulation structure, a method for fabricating the same, and a display panel, and the light-emitting element encapsulation structure includes: a first substrate; a second substrate arranged opposite to the first substrate; a light-emitting element located on the side of the second substrate facing the first substrate; an encapsulation layer made of a water-absorbent material, and filled in edge areas of the first substrate and the second substrate, wherein a hermetic space is defined by the encapsulation layer, the first substrate, and the second substrate, and the light-emitting element is located in the hermetic space; and a filler; the hermetic space is full of the filler except for an area occupied by the light-emitting element.

說明書

FIG. 17 is a schematic structural diagram of the first substrate aligned and fit with a second substrate according to some embodiments of this disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In order to make the objects, technical solutions, and advantages of embodiments of this disclosure more apparent, the technical solutions according to embodiments of this disclosure will be described below clearly and fully with reference to the drawings in embodiments of this disclosure. Apparently the embodiments to be described are only a part not all of the embodiments of this disclosure. Based upon the embodiments here of this disclosure, all of other embodiments which can occur to those ordinarily skilled in the art without any inventive effort shall come into the scope of this disclosure as claimed.

權利要求

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