In the related art, a light-emitting element is generally encapsulated using glass package, and as illustrated in FIG. 1 and FIG. 2 which are schematic structural diagrams of a light-emitting element encapsulation structure of glass package in the related art in a top view and a corresponding sectional view, the light-emitting element encapsulation structure includes: a display area AA (in the innermost dotted box, i.e., an orthographic projection of a light-emitting element 05 onto a first substrate 01), a first peripheral area S1 located around the display area AA and surrounding the display area AA (in a first dotted box around the area AA), and a second peripheral area S2 located around the first peripheral area S1 and surrounding the first peripheral area S1 (in a second dotted box around the area AA). In the related art, in order to encapsulate the light-emitting element using glass package, in order to avoid an encapsulation layer 03 from affecting the other layers, the encapsulation layer 03 is only fit in the outermost second peripheral area S2 of the first substrate 01 (in the box filled with slants), a filler 04 is filled in a semi-hermetic space defined by the encapsulation layer 03 and the first substrate 01, and then a second substrate 02 arranged with the light-emitting element 05 is aligned and fit with the first substrate 01. Since the material of the encapsulation layer 03 in use is generally epoxy resin, the encapsulation layer 03 can only be coated in the second peripheral area S2 of the first substrate 01, and the width thereof shall not be larger, so that lines or the other layers on the second substrate 02 will not be affected. Moreover, there is such limited hermetic performance of the encapsulation layer 03 that ambient humidity, oxygen, etc., tends to enter the light-emitting element encapsulation structure through the encapsulation layer 03 on the sides thereof, thus shortening the service lifetime of the light-emitting element.