The first scan driving circuit 20 and the first light-emitting driving circuit 30 may be covered by the inorganic insulating layer 109. The inorganic insulating layer 109 may prevent the connection wiring 71 including a metal such as Al, which is susceptible to damage from an etchant used in a process of manufacturing the display apparatus, from being exposed to an etching environment. As shown in FIG. 3, the inorganic insulating layer 109 may also located in the display area DA.

The inorganic insulating layer 109 may include an inorganic material such as SiOx, SiNx, or/and SiON, and may be formed to have a single layer structure or a multi-layer structure. In an embodiment, the inorganic insulating layer 109 may include SiNx. The inorganic insulating layer 109 may have a thickness equal to or greater than about 500 ?. In some implementations, a thickness of the inorganic insulating layer 109 may be equal to or greater than 1,000 ?, equal to or greater than 1,500 ?, equal to or greater than 2,000 ?, equal to or greater than 2,500 ?, equal to or greater than 3,000 ?, equal to or greater than 3,500 ?, equal to or greater than 4,000 ?, equal to or greater than 4,500 ?, equal to or greater than 5,000 ?, equal to or greater than 5,500 ?, equal to or greater than 6,000 ?, or equal to or greater than 6,500 ?. In some implementations, the inorganic insulating layer 109 may have a thickness ranging from about 7,000 ? to about 10,000 ?.